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An industrial control system consists of computer equipment and industrial process control components that automate various operations. Moreover, These systems take multiple forms and categorize into equipment-level, field-level, and system-level based on the application environment. As a result, industrial control motherboards must endure harsh environments, which demands high performance and reliability.
Furthermore, materials used in industrial motherboards must be resistant to high temperatures and moisture, meeting the needs of specific industrial settings. In addition, the motherboard interface design is either customized or includes numerous standard interfaces to adapt to various situations. On top of that, industrial control motherboards must operate in environments containing metal or ordinary dust, while also resisting strong electromagnetic interference. Consequently, they are built with robust radiation control capabilities to ensure stable performance.
Unlike standard commercial motherboards, industrial control motherboards are designed to run continuously throughout their lifecycle. Therefore, this extended operation requires exceptional durability and performance that standard consumer products cannot match.
With over 16 years of experience, Gorzim specializes in PCB design and assembly. Moreover, our advanced technology and intelligent production and testing equipment meet the stringent demands of industrial control systems. Notably, Gorzim has obtained certifications and formed strategic partnerships with several listed companies in this field. Thus, we offer a range of industrial control motherboard products, from small batch prototyping to mass production, including PCB design, PCBA mounting, and DIP packaging services.
Our product offerings include:
HMI PCBA circuit boards
PLC PCBA circuit boards
Motion control PCBA boards
Process Capability
Solder paste printer printing accuracy: ±0.02mm
Pringting repeat positioning accuracy: ±0.0125mm
Equipment reject material rate: within 5 parts per million
Mounting component size: CHIP 01005 (imperial system) ~ 100*90*21mm
IC Mounting accuracy: ±0.035mm
Mounting repeat positioning accuracy ±0.025mm
CPK≥1.0 SMT
Workshop 01005 SMD components, 0.2mm BGA placement capacity and quality control capabilities are very mature.
With 12 temperature zone nitrogen reflow furnace, the reflow soldering can be compatible with different PCB thickness (0.5mm ~ 3.2mm) and material (paper substrate, glass fiber substrate, synthetic fiber substrate, non-woven substrate, composite substrate, PFC board), and also can reduce the high temperature oxidation of solder and not easy to produce compounds with metal, but also to avoid metal oxidation because of air nitrogen is an inert gas, which to ensure the quality of solder and product Reliability.
